• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The electroplating method and system according to the present invention uses ultrasonic energy to enhance the electroplating process. The electroplating method includes the step of sweeping the plating surface with ultrasonic energy having a region where the ultrasonic energy density is maximum while simultaneously performing electroplating. The system includes a moving device that moves the ultrasonic energy source and the cathode relatively while the ultrasonic energy source and the cathode are disposed in the plating tank.
    公开号:KR20040035757A
    申请号:KR10-2004-7003380
    申请日:2002-08-01
    公开日:2004-04-29
    发明作者:장하이얀；크링케할란엘
    申请人:쓰리엠 이노베이티브 프로퍼티즈 캄파니；
    IPC主号:
    专利说明:

    ULTRASONICALLY-ENHANCED ELECTROPLATING APPARATUS AND METHODS}
    [2] Plating a deep hole, channel, or other high aspect ratio structure can present a challenging challenge. During plating of high aspect ratio structures, mass transfer and electrochemical processes may be undesirable, particularly at the deepest points of such high aspect ratio structures. For example, it is difficult to discharge bubbles generated during plating from a high aspect ratio structure; Metal ions are quickly depleted inside the high aspect ratio structure and cannot be properly replenished; It is not easy to remove undesirable decomposition products from near the cathode. In addition, the plating process tends to deposit thicker at the inlet of the hole or the upper edge of the channel, which may have a more significant effect on the plating of high aspect ratio structures. All these factors can cause defects in the plating process.
    [3] Various methods have been developed for plating of high aspect ratio structures. In some LIGA (Lithographie, Galvanoformung and Abformung) processes, high aspect ratio structures are plated using a conventional plating process but with a slower plating rate. Such plating is usually done on relatively small substrates, such as wafers. It is well known that traditional plating is difficult and time consuming. Plating of high aspect ratio structures was carried out by a specially designed instrument ("Enhanced Microelectroforming Technology and Development of an Automated Microelectroforming Workstation" by Ariel G. Schrodt and Nick N. Issaev during the abstract collection of the HARMST '97 World LIGA Forum in Madison, Wisconsin, June 1997). Was performed). In this method, parts are plated while applying vacuum and thermal gradients. Such plating can be performed at high speed, but expensive equipment can only plate small formats. Another technique for plating high aspect ratio structures is pulse plating (US Pat. No. 5,705,230) that fills recesses less than about 1 micron deep and wide.
    [4] Ultrasonic energy has been used as a cleaning aid in most cases in the plating process. However, US Pat. No. 5,705,230 uses ultrasonic energy while plating shallow recesses. US Pat. No. 4,842,699 describes the use of ultrasonic energy to ensure sufficient transport of electrolyte to the through holes during plating of the through-holes. U. S. Patent 5,695, 621 describes the use of a resonant electroplating anode when plating the inner surface of a steam generator piping. British Patent No. 2 313 605 describes a chrome plating process employing ultrasonic energy to encourage the release of bubbles. Japanese Patent No. 1 294 888 A describes the installation of an ultrasonic vibrator inside a cup to promote the discharge of bubbles. Japanese Patent No. 51138538 describes plating a printed circuit board while using ultrasonic energy.
    [5] Ultrasonic energy can enhance mass transfer and bubble removal during plating, but can also negatively affect plating. In the electroforming process, improper exposure to ultrasonic energy during electroforming can increase the stress remaining on the electroformed part. In addition, the use of ultrasonic energy during electroplating can lead to sticking problems between the deposition material and the substrate, particularly when using polymers or other nonconductive substrates.
    [6] Most electroplating processes are performed in plating tanks containing electroplating baths. Another problem that arises when using ultrasonic energy in a plating tank is the uneven energy distribution in the tank, especially on the cathode. When the ultrasonic transducer is mounted at a fixed position on the side or bottom of the plating tank, the distribution of ultrasonic energy on the cathode is uneven because the ultrasonic energy decreases with increasing distance. This problem is exacerbated when plating a large surface because the variation of the energy distribution on the surface of the large component is increased.
    [1] The present invention relates to the field of electroplating. More specifically, the present invention provides an electroplating apparatus and method enhanced by ultrasonic waves.
    [18] 1 is a plan view of one electroplating system according to the present invention.
    [19] 2 is a side view of the system shown in FIG.
    [20] 3 is a front view of the system of FIG. 1 with the anode 30 removed.
    [21] 4 is a diagram of another electroplating system.
    [22] 5 is a schematic view of the plating surface in which the region with the highest ultrasonic energy density is indicated by broken lines;
    [23] FIG. 6 is a variation of the plating surface shown in FIG. 5, in which the region where the ultrasonic energy density is maximum is larger than the plating surface. FIG.
    [24] FIG. 7 shows another electroplating system according to the invention in which sweeping of ultrasonic energy is carried out by rotational movement, taken transversely with respect to the axis of rotation.
    [25] 8 is a view of the system shown in FIG. 7 taken along line 8-8 of FIG.
    [26] 9 shows the relationship between the ultrasonic energy propagation axis and the central axis of the cavity in the plating surface.
    [7] The present invention provides an electroplating method and system employing ultrasonic energy to enhance the electroplating process. Such electroplating methods include disposing an ultrasonic energy source between the anode and the cathode, and sweeping the plating surface with the ultrasonic energy with the region with the largest ultrasonic energy density. As a result, each part of the plating surface receives ultrasonic energy in an amount that changes continuously during electroplating, and the plating surface is intermittently subjected to a maximum ultrasonic energy density.
    [8] The apparatus and method of the present invention can provide particular advantages when one or more cavities in which plating is desired to be performed are included in the plating surface. If a cavity, ie a hole formed through the cathode or a well formed in the surface of the cathode, has a relatively large aspect ratio, it may be difficult to electroplate the surface within the cavity. In some locations, the propagation axis of the ultrasonic energy (ie, the direction of movement of the ultrasonic energy) can be aligned with the cavity such that the ultrasonic energy reaches the entirety of the cavity, thereby strengthening the plating at the innermost part of the cavity.
    [9] Another advantage of the method and system according to the invention is that the amount of ultrasonic energy required to strengthen the electroplating is reduced. When ultrasonic energy is swept across the plating surface, each portion of the plating surface is intermittently exposed to the maximum ultrasonic energy density, so the amount of ultrasonic energy can be reduced.
    [10] Another advantage of the present invention is that problems associated with using ultrasonic energy during plating as discussed in the background art, such as residual stress, adhesion problems, etc., can be reduced by sweeping ultrasonic energy across the plating surface. . In addition, the sweeping nature of the ultrasonic energy can improve the uniformity of the plated material.
    [11] Another advantage of the method and system according to the invention is that the problems associated with blocking or shielding which may be caused by disposing the structure between the anode and the cathode are reduced or avoided through the movement of the ultrasonic energy source, Ultrasound energy is directly bubbly at the plating surface. In such a system in which an ultrasonic energy source moves between an anode and a cathode during electroplating, the pulsed plating process (intentionally changing the current density) is achieved by intermittently shielding the cathode by the moving ultrasonic energy source. Similar electroplating advantages can be provided.
    [12] The present invention may provide particular advantages when used to electroform high aspect ratio cavities, but may also be beneficial when used in connection with electroplating any surface regardless of whether or not it contains a high aspect ratio cavity. Unless otherwise stated, the invention is not limited to methods and / or systems for electroforming high aspect ratio cavities.
    [13] In one aspect, the present invention provides a method for electroplating, the method comprising providing a tank containing a plating solution; Placing a cathode having an anode and a plating surface into the plating solution; Disposing an ultrasonic energy source directly between the anode and the plating surface of the cathode; Plating the plating surface of the cathode; And sweeping the plating surface with ultrasonic energy emitted from an ultrasonic energy source during plating, wherein the sweeping step includes moving the region with the highest ultrasonic energy density across the plating surface.
    [14] In another aspect, the present invention provides a method of electroplating, the method comprising providing a tank containing a plating solution; Placing a cathode having an anode and a plating surface into the plating solution; Plating the plating surface of the cathode; Placing an ultrasonic energy source directly between the anode and the plating surface of the cathode; And sweeping the plating surface with ultrasonic energy emitted from the ultrasonic energy source during plating, wherein the plating surface of the cathode comprises a plurality of cavities, each of the plurality of cavities defining a central axis. Having an aspect ratio of at least about 1: 1 or more, and the ultrasonic energy emitted from the ultrasonic energy source has a predetermined propagation axis.
    [15] The sweeping step includes moving the region of maximum ultrasonic energy density across the plating surface; Moving the plating surface and the ultrasonic energy source relative to each other while releasing ultrasonic energy from the ultrasonic energy source; And aligning the propagation axis of the ultrasonic energy with the central axis of each of the plurality of cavities.
    [16] In another aspect, the present invention provides an electroplating apparatus, comprising: a tank having a predetermined tank volume; An anode disposed within said tank volume; A cathode disposed in said tank volume and comprising a plating surface; An ultrasonic energy source disposed within the tank volume and disposed directly between the anode and the cathode and oriented to emit ultrasonic energy to the plating surface; And a moving device for relatively moving the ultrasonic energy source and the cathode while the ultrasonic energy source and the cathode are disposed in the tank volume.
    [17] The foregoing features, advantages, and others of the present invention are described below in connection with various exemplary embodiments of methods and systems according to the present invention.
    [27] 1 and 2 show one exemplary electroplating system according to the present invention. This system is to be understood as illustrative in nature. In accordance with the present invention many other systems can be devised which preferably sweep the region of maximum ultrasonic energy density across the plating surface.
    [28] The "sweeping" or "relative motion" associated with the present invention is preferably continuous (the velocity of the region where the ultrasonic energy density is maximum becomes zero only during the change of direction), but alternatively such movement is slightly between discontinuous movements. It is understood that it may be made in stages so that there is a fixed stop time of However, any fixed down time preferably accounts for about 5% or less of the total time that the plating enhanced by ultrasound is performed.
    [29] The system shown includes a plating tank 10 that houses a cathode 20 and an anode 30. In addition, an ultrasonic energy source 40 is disposed in the plating tank 10, which is disposed directly between the cathode 20 and the anode 30. In addition, the system preferably includes a mobile device 50 described in more detail below.
    [30] 1 shows the top of the plating tank 10 along the upper edge of the cathode 20 and the anode 30. This figure also shows the upper end of the ultrasonic energy source 40 and the upper edge of the side wall of the plating tank 10. 2 is a side view of the system, showing the side edges of the cathode 20, the anode 30 and the preferred ultrasonic energy source 40. 3 is a front view of the system with the plating tank 10 and anode 30 removed to reveal the ultrasonic energy source 40 and cathode 20.
    [31] Also shown in FIGS. 1-3 is a mobile device 50. As will be described in more detail below, the moving device 50 is used to move the ultrasonic energy source 40 across the cathode 20. Most, if not all, of the moving device 50 is preferably disposed outside of any plating solution contained in the plating tank 10.
    [32] The moving device 50 is preferably capable of reciprocating back and forth the ultrasonic energy source 40 across the plating surface 22 of the cathode 20 during electroplating. Any instrument or combination of instruments known to those skilled in the art can be used to provide the desired reciprocating motion. Examples include, but are not limited to, cam and follower mechanisms, ball reversing mechanisms, and the like.
    [33] In addition, the movement mechanism 50 is shown as the cathode 20 remains fixed and the ultrasonic energy source 40 moves, but the ultrasonic energy source 40 remains fixed and the cathode 20 moves. It is understood that other systems may be provided. In another variation, both the cathode 20 and the ultrasonic energy source 40 may move (at the same time or at different times).
    [34] Plating tank 10 may be of any suitable shape and / or configuration. For example, it may have a substantially rectangular top opening and three substantially vertical sidewalls extending to the bottom. The fourth sidewall is moderately inclined with respect to the vertical direction, thereby improving plating of a relatively flat substrate that is attached to the cathode structure 20 and subsequently placed against the inclined sidewall. Such plating tank structures are known in the art and will not be described further herein.
    [35] Appropriate pumps and fluid reservoirs are attached to the plating tank 10 to provide any desired circulation of the electroplating solution. In some examples, fresh electroplating solution may be metered into tank 10 as needed, and at the same time the used solution is removed from tank 10 during plating.
    [36] The cathode 20 is disposed in the plating tank 10 to be immersed in the plating solution during plating. The cathode 20 comprises or forms a plating surface 22 on which plating is preferentially performed. The cathode 20 is generally provided in the form of an object or substrate that can be removed from the system after electroplating is complete.
    [37] If the cathode treated by the method according to the invention consists of a material having an electrical conductivity which is not sufficient to adequately electroplate, it is desirable to provide a thin electrically conductive layer on at least the plating surface 22. This layer may be deposited or formed by any suitable technique, such as sputtering, chemical vapor deposition, mirror reaction, electroless plating, and the like.
    [38] In addition, the anode 30 is also disposed in the tank 10 in a manner that is submerged in the plating solution during plating. For example, the anode 30 may be provided in the form of a metal plate or basket including metal balls or pellets. In many cases, anode bags are used to reduce or prevent leakage of anode sludge into the plating bath. In addition, an anode shield can be used to improve the current distribution.
    [39] As mentioned above, the components of the system are mostly conventional in shape and size. However, according to the present invention, the system further comprises an ultrasonic energy source 40 disposed directly between the cathode 20 and the anode 30. As used herein, the expression “disposed directly between” may mean that the ultrasonic energy source 40 is disposed so that the line of sight of the anode 30 onto the cathode 20 is partially obscured by the ultrasonic energy source 40. It means interposed between the cathode 20 and the anode 30.
    [40] In a typical electroplating system, an obstacle placed directly between the cathode 20 and the anode 30 may cause non-uniform plating due to shading and other effects. As a result, known electroplating systems and methods do not introduce obstacles between the cathode 20 and the anode 30. Alternatively, the present invention places the ultrasonic energy source 40 directly between the cathode 20 and the anode 30. However, the negative effect of blocking the path between the cathode 20 and the anode 30 is that the ultrasonic energy source 40 blocking the cathode 20 does not result in uneven plating so that the ultrasonic energy source ( By moving 40).
    [41] An ultrasonic energy source 40 is mounted in the system such that the ultrasonic energy emitted by the ultrasonic energy source 40 faces the plating surface 22 of the cathode 20. Ultrasonic energy impinging on the plating surface 22 is preferably distributed evenly on the plating surface 22 in a direction corresponding to the direction of extension of the ultrasonic energy source 40, for example, d 1 in FIG. It is not. To achieve this goal, the ultrasonic energy source 40 preferably extends (eg, in the form of a bar, beam) to span the plating surface 22 of the cathode 20 along one direction d 1 . The ultrasonic energy source 40 may be provided in the form of one long transducer, or may be provided in an array of transducers mounted along an axis.
    [42] The ultrasonic energy source 40 preferably spans the plating surface 22 of the cathode 20 in one direction (eg d 1 ), but the plating surface of the cathode along the second direction (eg d 2 in FIG. 3). It is also preferable to be provided narrower than (22). The second direction is not at least parallel to the first direction. The second direction is preferably perpendicular to the first direction, for example as shown in FIG. 3.
    [43] Referring to FIG. 4, where the ultrasonic energy source 40 is shown along one end, the ultrasonic energy source 40 emits ultrasonic energy in a waveform 43 usually in the direction of the plating surface 22. When this wave energy strikes the plating surface 22, it forms an area with the highest ultrasonic energy density, which usually corresponds to the shortest distance between the ultrasonic energy source 40 and the plating surface 22. 4 shows an exemplary region 44 with the highest ultrasonic energy density.
    [44] The ultrasonic energy density that the plating surface 22 receives has a theoretical profile, in which only a very small portion of the plating surface 22 has an absolute maximum energy density, that is, the highest ultrasonic energy density that the plating surface receives at a given time. Receive. However, as the invention intends, the "area with the highest ultrasonic energy density" can be defined as the area of the plating surface 22 that receives, for example, at least about 95% or more of the absolute maximum energy density.
    [45] 5 is a schematic diagram of the plating surface 122 in which the region 144 with the highest ultrasonic energy density is indicated by broken lines. In accordance with the present invention, the region 144 is swept at least twice in the direction of the double-headed arrow S across the plating surface 122 such that a randomly selected point on the plating surface 122 is exemplified at maximum ultrasonic energy density during plating. For example, at least two exposures.
    [46] The system or method shown in FIG. 5 shows the case where the region 144 with the highest ultrasonic energy density is smaller than the plating surface 122 in at least one dimension, while FIG. 6 shows the region 244 with the highest ultrasonic energy density. ) Is another variation where plating surface 222 is greater in all dimensions. Thus, sweeping the region 244 in accordance with the method of the present invention requires moving the region 244 relative to the plating surface 222, as a result of which the plating surface 222 is shown in FIG. 6. A portion of) will be located outside of region 244.
    [47] 7 and 8 show another variant of the system and method according to the invention in which the plating surface 322 on the cathode 320 is disposed within the plating tank 310 while rotating about the axis of rotation 323. . An ultrasonic energy source 340 is disposed in the tank 340 between the anode 330 and the plating surface 322. When the cathode is rotated about axis 323 (by any suitable rotating mechanism), the region with the highest ultrasonic energy density is swept onto plating surface 322. According to this method of the present invention, the cathode 320 is disposed such that each portion of the plating surface 322 passes at least twice in front of the ultrasound energy source 340 so that ultrasonic energy is repeatedly swept in accordance with the method of the present invention. It is usually desirable to rotate. Although the cathode 320 is shown to move, the cathode 20 may alternatively remain fixed and the ultrasonic energy source 40 may move, in another variation, the cathode 320 and the ultrasonic energy source 340. It is understood that all of these may move simultaneously or at different times.
    [48] 9 shows another optional feature of the method and apparatus according to the invention. Plating surface 422 is provided on cathode 420 (only a portion of which is shown in FIG. 9). The plating surface 422 includes a space formed to completely pass through one cavity, ie, the cathode 420, in the form of a through hole 460. Also shown in FIG. 9 are other cavities in the form of wells 470 that are not formed to fully pass through the cathode 420 like the through holes 460.
    [49] The cavity, i.e., the through hole 460 and the well 470, respectively (respectively) form a central axis 461, 471 extending from the cavity. Each cavity also forms an aspect ratio, which is the ratio of the depth of the cavity to the width of the cavity along the axis, where the width is measured transverse to the depth of the cavity at the center point of the depth of the cavity. The cavities formed on the plating surface of the cathode according to the invention have a high aspect ratio (d: w), ie an aspect ratio of at least about 1: 1.
    [50] As the present invention intends, the depth of the through hole 460 can usually be defined as the thickness of the cathode 420. The axes 461, 471 are shown perpendicular to the substantially flat plating surface 422, but in some instances a central axis that is not perpendicular to the plating surface 422, that is, inclined with respect to the vertical direction, will be provided in the cavity. It is understood that it can.
    [51] The ultrasonic energy source 440 of FIG. 9 is shown to emit ultrasonic energy in waveforms, which form a propagation axis 445 that spreads from the ultrasonic energy source 440. Although only a few propagation axes are shown in FIG. 9, there are a number of propagation axes and it is understood that the illustrated propagation axes are merely exemplary in nature.
    [52] In some aspects of the invention, it is preferred that at least one of the propagation axes of the ultrasonic energy emitted from the ultrasonic energy source 440 is aligned with the central axis of each cavity in the cathode 42. Aligning the propagation axis with the central axis of the cavity can enhance the transmission of ultrasonic energy to the deepest portion of the cavity, thereby enhancing the plating in the cavity.
    [53] In the method according to the invention, the power level at which the ultrasonic energy source is operated depends on the material to be plated on the cathode, the size of the cathode, the desired plating thickness, the aspect ratio of any cavity on the plating surface, whether the plating is conformal, plating It may vary based on various factors, including but not limited to the composition of the bath, the current density between the anode and the cathode, and the like.
    [54] Because of the sweeping nature of the ultrasonic energy, the energy density of the ultrasonic energy is significantly lower than that typically used in cleaning processes or plating processes enhanced by conventional ultrasonics (no ultrasonic energy is swept onto the plating surface). For example, the energy density used during plating is only about 10% of the energy density used during cleaning because it is not necessary to empty the plating solution in the tank.
    [55] Although the present invention is directed to ultrasonically enhanced electroplating methods, it may be desirable to provide ultrasonic energy in the plating tank only during a portion of the time that electroplating occurs. For example, in one method it may be desirable to sweep the ultrasonic energy onto the plating surface only after the initial electroplating without ultrasonic energy. In another method, it may be desirable to first electroplate the ultrasonic energy while sweeping on the plating surface, and then continue electroplating without ultrasonic energy while stopping the supply of ultrasonic energy. In either method, the plating current density may be the same during all steps, and may be changed as necessary.
    [56] In another method, after performing some initial electroplating without ultrasonic energy, the plating is performed while sweeping the ultrasonic energy onto the plating surface, and then the electroplating is continuously performed while stopping the transfer of the ultrasonic energy to the plating surface. It may be desirable. As mentioned above, the plating current density may be the same during all the steps and may be changed as necessary.
    [57] Yes
    [58] The following examples are provided to aid the understanding of the present invention and are not intended to limit the scope of the present invention.
    [59] Provide a plating tank containing 65 gallons (246 liters) of plating solution. The cathode was placed in the tank with the target surface facing up and oriented at 45 ° to the horizontal direction. The cathode is a flat polyimide substrate mounted on glass and includes a cavity in the plating surface. The aspect ratio of the cathode was about 28: 1. An electroconductive seed layer of silver was formed on the plating surface before electroplating in a mirror reaction.
    [60] The anode was prepared in the form of nickel pellets contained in a titanium basket. These pellets are manufactured by International Nickel Company. The anode bag was placed around the anode. An anode was mounted substantially parallel to the cathode.
    [61] An ultrasonic transducer was placed between the anode and the target surface of the cathode directly in the tank so that the ultrasonic transducer and the target surface of the cathode faced. The ultrasonic transducer is a model N-100 (NEPTUNE series) of CAE Ultrasonics (Jamestown, NY) with an average power of 350 W (350 J / s) and a frequency of 40 kHz.
    [62] The ultrasonic transducer was mounted on a reciprocating device. The reciprocating device was placed on a plating tank and moved back and forth across the plating surface of the cathode during the plating process.
    [63] The plating solution comprises a small amount of surfactant (Barrett Snap L from McDermid) which adjusts 500 g / l nickel sulfamate, 30 g / l boric acid and surface tension to 29 dyn / cm 2 (measured using Fisher Scientific SURFACE TENSIOMAT 21). It is a water tank containing (水槽). The temperature of the plating solution was 135 ° F. (57 ° C.). The plating solution was circulated at a rate of approximately 10 times per hour in the plating tank during plating.
    [64] Once all the components are in place, start electroplating at a current density of 1 ASF (0.108 A / dm 2) without ultrasonic energy for one hour, and then sweep the ultrasonic energy across the plating surface for 24 hours for the same current. Electroplating was carried out at a density, after which the transfer of ultrasonic energy was stopped. However, electroplating was continued at a current density of 15 ASF (1.62 A / dm 2) without ultrasonic energy for 24 hours.
    [65] During electroplating, the ultrasonic transducer was operated at a power level of about 35 W (35 J / s). The ultrasonic transducer was reciprocated back and forth across the plating surface of the cathode during plating so that the ultrasonic transducers each completed a pass in one direction on the plating surface about every 30 seconds.
    [66] According to this process, the plating surface is electroplated with nickel, providing high quality, solid structure, low stress, good adhesion and even distribution.
    [67] The specific embodiments described above are illustrative of the practice of the invention. The present invention may be suitably practiced without any elements or items not specifically described herein.
    [68] Various modifications and variations of the present invention will be apparent to those skilled in the art without departing from the scope of the present invention. For example, while the system and method is shown using only one ultrasonic energy source, two or more ultrasonic energy sources may be used to provide ultrasonic energy to the target surface during plating. In other examples, curved or other non-planar target surfaces may be plated. It is to be understood that the present invention is not to be unduly limited to the exemplary embodiments described herein.
    权利要求:
    Claims (26)
    [1" claim-type="Currently amended] Providing a tank containing a plating solution;
    Placing a cathode having an anode and a plating surface into the plating solution;
    Disposing an ultrasonic energy source directly between the anode and the plating surface of the cathode;
    Plating the plating surface of the cathode; And
    Sweeping the plating surface with ultrasonic energy emitted from the ultrasonic energy source during the plating
    Wherein the sweeping step includes moving the region of maximum ultrasonic energy density across the plating surface.
    [2" claim-type="Currently amended] The electroplating method of claim 1, wherein the plating surface comprises one or more cavities having a central axis, the ultrasonic energy having a propagation axis, and aligning the propagation axis to the central axis.
    [3" claim-type="Currently amended] The method of claim 2, wherein the one or more cavities have an aspect ratio of at least about 1: 1.
    [4" claim-type="Currently amended] 3. The method of claim 2, wherein the one or more cavities include holes formed through the cathode.
    [5" claim-type="Currently amended] 3. The method of claim 2, wherein the at least one cavity comprises a well formed in the plating surface.
    [6" claim-type="Currently amended] 2. The method of claim 1, wherein sweeping the plating surface with ultrasonic energy comprises sweeping the plating surface two or more times.
    [7" claim-type="Currently amended] 2. The method of claim 1, wherein sweeping the plating surface with ultrasonic energy comprises moving the plating surface and the ultrasonic energy source relative to each other.
    [8" claim-type="Currently amended] The method of claim 1, wherein the plating of the plating surface comprises: plating at a first current density without ultrasonic energy emitted from the ultrasonic energy source, and then plating at a second current density while sweeping the plating surface with ultrasonic energy. Electroplating method comprising the step of.
    [9" claim-type="Currently amended] The electroplating method of claim 8, wherein the first current density is not equal to the second current density.
    [10" claim-type="Currently amended] The method of claim 1, wherein the plating of the plating surface comprises plating at a first current density while sweeping the plating surface with ultrasonic energy and then plating at a second current density without ultrasonic energy emitted from the ultrasonic energy source. Electroplating method comprising the step of.
    [11" claim-type="Currently amended] The electroplating method of claim 10, wherein the first current density is not equal to the second current density.
    [12" claim-type="Currently amended] The method of claim 1, wherein the plating of the plating surface comprises:
    Plating at a first current density without ultrasonic energy emitted from the ultrasonic energy source;
    Plating at a second current density while sweeping the plating surface with ultrasonic energy;
    Stopping the transfer of ultrasonic energy to the plating surface; And
    Plating at a third current density after stopping the transmission of ultrasonic energy to the plating surface.
    [13" claim-type="Currently amended] The electroplating method of claim 12, wherein the first current density, the second current density, and the third current density are all different from each other.
    [14" claim-type="Currently amended] Providing a tank containing a plating solution;
    Placing a cathode having an anode and a plating surface into the plating solution;
    Plating the plating surface of the cathode;
    Placing an ultrasonic energy source directly between the anode and the plating surface of the cathode; And
    Sweeping the plating surface with ultrasonic energy emitted from an ultrasonic energy source emitted from the ultrasonic energy source during the plating
    Wherein the plating surface of the cathode comprises a plurality of cavities, each of the cavities having a central axis and having an aspect ratio of at least about 1: 1 or more, and the ultrasonic energy emitted from the ultrasonic energy source is a predetermined propagation axis. With
    The sweeping step includes moving the region of maximum ultrasonic energy density across the plating surface;
    Sweeping the plating surface with ultrasonic energy includes moving the plating surface and the ultrasonic energy source relative to each other while releasing ultrasonic energy from the ultrasonic energy source;
    Wherein said sweeping step comprises aligning the propagation axis of said ultrasonic energy with each central axis of said plurality of cavities.
    [15" claim-type="Currently amended] 15. The method of claim 14, wherein the plating of the plating surface comprises: plating at a first current density without ultrasonic energy emitted from the ultrasonic energy source, and then plating at a second current density while sweeping the plating surface with ultrasonic energy. Electroplating method comprising the step of.
    [16" claim-type="Currently amended] The method of claim 15, wherein the first current density is not equal to the second current density.
    [17" claim-type="Currently amended] 15. The method of claim 14, wherein plating the plating surface comprises plating at a second current density without ultrasonic energy emitted from the ultrasonic energy source after plating at the first current density while sweeping the plating surface with ultrasonic energy. Electroplating method comprising the step of.
    [18" claim-type="Currently amended] 18. The method of claim 17, wherein the first current density is not equal to the second current density.
    [19" claim-type="Currently amended] The method of claim 14, wherein plating the plating surface comprises:
    Plating at a first current density without ultrasonic energy emitted from the ultrasonic energy source;
    Plating at a second current density while sweeping the plating surface with ultrasonic energy;
    Stopping the transfer of ultrasonic energy to the plating surface; And
    Plating at a third current density after stopping the transmission of ultrasonic energy to the plating surface.
    [20" claim-type="Currently amended] 20. The method of claim 19, wherein the first current density, second current density and third current density are all different.
    [21" claim-type="Currently amended] A tank having a predetermined tank volume;
    An anode disposed within said tank volume;
    A cathode disposed in said tank volume and having a plating surface;
    An ultrasonic energy source disposed within the tank volume and disposed directly between the anode and the cathode and oriented to emit ultrasonic energy to the plating surface; And
    A moving device for relatively moving the ultrasonic energy source and the cathode while placing the ultrasonic energy source and the cathode in the tank volume.
    Electroplating apparatus comprising a.
    [22" claim-type="Currently amended] 22. The electroplating apparatus of claim 21, wherein the moving device comprises a reciprocating device capable of moving the ultrasonic energy source and the cathode relative to each other.
    [23" claim-type="Currently amended] 22. The electroplating apparatus of claim 21, wherein the moving device comprises a reciprocating device operatively attached to the ultrasonic energy source to reciprocate the ultrasonic energy source in the tank volume.
    [24" claim-type="Currently amended] 22. The electroplating apparatus of claim 21, wherein the moving device comprises a reciprocating device operably attached to the cathode to reciprocate the cathode in the tank volume.
    [25" claim-type="Currently amended] 22. The electroplating apparatus of claim 21, wherein the moving device comprises a rotary motion device capable of rotating the cathode about an axis of rotation.
    [26" claim-type="Currently amended] 22. The electroplating apparatus of claim 21, wherein the moving device comprises a rotary motion device capable of rotating the ultrasonic energy source about a rotation axis.
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    同族专利:
    公开号 | 公开日
    US20030042145A1|2003-03-06|
    EP1516077A2|2005-03-23|
    TW574439B|2004-02-01|
    KR100920789B1|2009-10-08|
    AU2002322853A1|2003-03-18|
    US6746590B2|2004-06-08|
    EP1516077B1|2006-04-26|
    WO2003021007A2|2003-03-13|
    CN100432300C|2008-11-12|
    AT324475T|2006-05-15|
    DE60211035T2|2006-11-30|
    WO2003021007A3|2005-01-06|
    CN1612950A|2005-05-04|
    DE60211035D1|2006-06-01|
    JP4440636B2|2010-03-24|
    JP2005524764A|2005-08-18|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2001-09-05|Priority to US09/946,922
    2001-09-05|Priority to US09/946,922
    2002-08-01|Application filed by 쓰리엠 이노베이티브 프로퍼티즈 캄파니
    2002-08-01|Priority to PCT/US2002/024396
    2004-04-29|Publication of KR20040035757A
    2009-10-08|Application granted
    2009-10-08|Publication of KR100920789B1
    优先权:
    申请号 | 申请日 | 专利标题
    US09/946,922|2001-09-05|
    US09/946,922|US6746590B2|2001-09-05|2001-09-05|Ultrasonically-enhanced electroplating apparatus and methods|
    PCT/US2002/024396|WO2003021007A2|2001-09-05|2002-08-01|Ultrasonically-enhanced electroplating apparatus and methods|
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